Lectrosonics Inc. introduced the L1 sub-miniature lavalier microphone, featuring Sonaura MEMS technology. The microphone is designed for film, television and theater applications requiring high-fidelity audio capture.
The L1 uses Micro-Electro-Mechanical Systems silicon technology manufactured by semiconductor leader Infineon. This studio-grade technology replaces traditional FET-based designs with a patented encapsulated diaphragm. The capsule is the result of a five-year, $10 million research investment. Unlike traditional capsules that vary between batches, the L1 silicon fabrication ensures precision. Every L1 unit is matched in both sensitivity and frequency response to within 0.5 dB, offering production mixers and sound designers repeatability across multiple talent microphones.
Specifications include an equivalent input noise of 11 dB(A) and an 83 dB signal-to-noise ratio. When paired with the Lectrosonics DSSM transmitter, the microphone features a switchable sensitivity mode, allowing it to handle up to 135 dBA SPL. The design supports a natural, uncolored sound tailored via interchangeable acoustic caps included for either flat or elevated high-frequency response.
Designed for harsh production environments, the L1 is impervious to moisture. The combination of the Sonaura capsule properties, a specialized hydrophobic internal coating, and hydrostatic pressure-sealing via 0.4 mm laser-drilled cap ports allows the microphone to remain functional while completely submerged. When used with the IP57-rated Lectrosonics DSSM micro-transmitter, the assembly provides resistance against sweat and environmental hazards.
The L1 maintains a 5.4 mm diameter footprint, compatible with standard industry mounting accessories. It features an ultra-flexible Kevlar-reinforced cable and a unique ID ring system at the connector for rapid on-set identification.
Karl Winkler, Executive Vice President of Product and Sales at Lectrosonics, said the launch culminates the acoustic expertise of the Freedman Group, the manufacturing of Infineon and Lectrosonics audio electronics heritage. By leveraging MEMS technology, the company moved beyond physical limitations of traditional microphones to give users a tool that is more consistent, robust and quieter than previously possible, Winkler said.
The L1 is available in the second quarter of 2026 in black with a LEMO connector. White, brown and beige colors and 5-pin connector variants will follow later in 2026. Expected MSRP ranges from $500 to $700 depending on kit and connector options.
Lectrosonics will exhibit at the NAB show in Las Vegas, Nev., April 19-22, 2026, booth C5307 in the Central Hall.
For more information, visit lectrosonics.com.